Mg Chemicals 832HT 环氧树脂胶 耐高温树脂 变压器 200度高温树脂 Mg Che详细介绍
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Description
The 832HT High Temperature Epoxy Encapsulating and Potting Compound is an electronic grade epoxy designed for high temperature environments. It is also an ideal encapsulant for very chemically aggressive environments and applications where extreme physical strength is required.
It protects against static discharges, shocks, vibrations, and mechanical impacts. It is extremely resistant to environmental humidity, salt water, and harsh chemicals. It also helps hide and restrict access to intellectual property, and it much harder to remove than standard epoxy encapsulating compounds.
Applications & Usages
The 832HT epoxy is used to pot or encapsulate printed circuit assemblies in a protective block. The cured epoxy improves reliability, operational range, and lengthens the life of electrical and electronic parts.
Its primary applications involve protecting electronic devices in high temperature and chemically aggressive environments in the automobile, marine, aerospace, aviation, communication, instrumentation, and industrial control equipment.
特性：
· 高工作温度范围 200 °C [392 °F]，间歇性 250°C
· 很强的耐化学腐蚀性能
· 重量比2：1，体积比1.7：1可兼容大部份点胶设备，实现快速量产化
· ***的耐水性和湿度，如果需要允许淹没
· 隐秘灌封，产品内部不易被窥视
· 保护电子设备免受潮温、腐蚀、真菌、热冲击和静电放电
· 适用于卤、酸、碱和脂肪烃的***环境
Curing & Work Schedulea
| au | 可操作时间： | 完全固化 (at 20°C [68 °F]) FullCure (at 65°C [149 °F]) | 60 minute | 45 minute Full Cure (at 130°C [266 °F]) FullCure (at 160°C [320 °F]) | 15 minute | 10 minute |
a) Working life and full cure assumes room temperature and 100g. A 10 °C increase can decreases the pot life by half. | au | Unmixed Parts | [60 to 80 °F] |
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Service Ranges |
| au | 工作温度 | [-22 to +392 °F] | -40 to +250 °C Physical PropertiesMethodVlea密度 (at 23 °C [73.4 °C]) | Black 3(Shore D durometer) | 87D | 3.38% | 抗拉强度抗压强度 | " ASTM D 695 | 2 281.84 N/mm[11,870 lb/in] | 搭桥剪切强度弯曲强度 | ASTM D 790 | 2 2100.66 N/mm[14,600 lb/in] | " | 2 2Electric PropertiesbMethodVleBreakdown Voltage @0.630 mm DielectricStrength | " | 44.82 kV/mm [1138 V/mil] | Reference fit | 17.9 kV/mm [454 V/mil] | cASTM D 257 " | 1?? 1? | ASTM D 150-98 | Dissipation & Constant @10 kHz" | Dissipation & Constant @100 kHz" | Dissipation & Constant @1 MHz" | Isulating Conductive | | |
Note: Specifications are for epoxy samples cured at 65 °C for 1 hour, with additional curing time at room temperature for optimal results. For most tests, samples were conditioned at 23 °C and 50% RH. a) N/mm2 = mPa; lb/in2 = psi; b) To allow comparison between products, the Tautscher equation was fitted to 10 experimental dielectric strengths and interpolated for astandard reference thickness of 1/8” (3.175 mm). c) The surface (sheet) resistivity unit is commonly referred to as “Ohm per square” (?/sq) Properties of Cured 832HT (Continued) | | au | ASTM E 1461 92 | K Coefficient of Thermal Expansion | 75.7 ppm/°C | | +25 °C to +250 °C | +100 °C to +250 °C | Oeall CTE | 125.3 ppm/°C | e" ASTM D 648 | -m/s K53.9 °C [129 °F] |
a) Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10-6 = unit/unit/°C × 10-6 b) HDT of plastic under load of 264 lb/in2 Properties of Uncured 832HT | | Viscosityat 20 °C [73 °F] Density | 40,000 cP [40.0 Pa·s] Mix Ratio by weight (A:B) Mix Ratio byvolume (A:B) | 1.7:1 | | | | | | | Viscosityat 24°C [73 °F] Density | 46 000 cP [46.0 Pa·s] Clear, amber tint 5 800 cP[5.8 Pa·s] Flash Point 150 °C [302 °F] Mild | *** Musty |
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a) Brookfield viscometer at 50 RPM with spindle LV4 |
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